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  december 2012 hvm-1065-b 1 < hvigbt modules > CM800HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules CM800HC-90R ? i c 800a ? v ces 4500v ? 1-element in a pack ? insulated type ? lpt-igbt / soft recovery diode ? alsic baseplate application traction drives, high reliability c onverters / inverters, dc choppers outline drawing & circuit diagram dimensions in mm
< hvigbt modules > CM800HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 2 maximum ratings symbol item conditions ratings unit v ge = 0v, t j = -40?+125c 4500 v ces collector-emitter voltage v ge = 0v, t j = ? 50c 4400 v v ges gate-emitter voltage v ce = 0v, t j = 25c 20 v i c dc, t c = 85c 800 a i crm collector current pulse (note 1) 1600 a i e dc 800 a i erm emitter current (note 2) pulse (note 1) 1600 a p tot maximum power dissipation (note 3) t c = 25c, igbt part 8300 w v iso isolation voltage rms, sinusoidal, f = 60hz, t = 1 min. 6000 v v e partial discharge extinction voltage rms, sinusoidal, f = 60hz, q pd 10 pc 3500 v t j junction temperature ? 50 ~ +150 c t jop operating junction temperature ? 50 ~ +125 c t stg storage temperature ? 55 ~ +125 c t psc short circuit pulse width v cc = 3200v, v ce v ces , v ge =15v, t j =125c 10 ? s electrical characteristics limits symbol item conditions min typ max unit t j = 25c ? ? 10.0 i ces collector cutoff current v ce = v ces , v ge = 0v t j = 125c ? 10.0 ? ma v ge(th) gate-emitter threshold voltage v ce = 10 v, i c = 80 ma, t j = 25c 5.8 6.3 6.8 v i ges gate leakage current v ge = v ges , v ce = 0v, t j = 25c ? ? 0.5 a c ies input capacitance ? 117.0 ? nf c oes output capacitance ? 7.3 ? nf c res reverse transfer capacitance v ce = 10 v, v ge = 0 v, f = 100 khz t j = 25c ? 3.3 ? nf q g total gate charge v cc = 2800v, i c = 800a, v ge = 15v, t j = 25c ? 9.0 ? c t j = 25c ? 3.50 ? v cesat collector-emitter saturation voltage i c = 800 a (note 4) v ge = 15 v t j = 125c ? 4.40 5.10 v t j = 25c ? 1.00 ? t d(on) turn-on delay time t j = 125c ? 0.95 1.50 s t j = 25c ? 0.28 ? t r turn-on rise time t j = 125c ? 0.30 0.50 s t j = 25c ? 2.90 ? e on(10%) turn-on switching energy (note 5) t j = 125c ? 3.55 ? j t j = 25c ? 3.10 ? e on turn-on switching energy (note 6) v cc = 2800 v i c = 800 a v ge = 15 v r g(on) = 4.0 ? l s = 150 nh inductive load t j = 125c ? 3.80 ? j t j = 25c ? 3.60 ? t d(off) turn-off delay time t j = 125c ? 3.80 5.00 s t j = 25c ? 0.35 ? t f turn-off fall time t j = 125c ? 0.45 1.00 s t j = 25c ? 1.95 ? e off(10%) turn-off switching energy (note 5) t j = 125c ? 2.55 ? j t j = 25c ? 2.15 ? e off turn-off switching energy (note 6) v cc = 2800 v i c = 800 a v ge = 15 v r g(off) = 15 ? l s = 150 nh inductive load t j = 125c ? 2.85 ? j
< hvigbt modules > CM800HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 3 electrical characteristics (continuation) limits symbol item conditions min typ max unit t j = 25c ? 2.50 ? v ec emitter-collector voltage (note 2) i e = 800 a (note 4) v ge = 0 v t j = 125c ? 2.80 3.40 v t j = 25c ? 0.70 ? t rr reverse recovery time (note 2) t j = 125c ? 0.90 ? s t j = 25c ? 780 ? i rr reverse recovery current (note 2) t j = 125c ? 850 ? a t j = 25c ? 660 ? q rr reverse recovery charge (note 2) t j = 125c ? 1000 ? c t j = 25c ? 0.85 ? e rec(10%) reverse recovery energy (note 2) (note 5) t j = 125c ? 1.35 ? j t j = 25c ? 1.00 ? e rec reverse recovery energy (note 2) (note 6) v cc = 2800 v i c = 800 a v ge = 15 v r g(on) = 4.0 ? l s = 150 nh inductive load t j = 125c ? 1.55 ? j thermal characteristics limits symbol item conditions min typ max unit r th(j-c)q junction to case, igbt part ? ? 15.0 k/kw r th(j-c)d thermal resistance junction to case, fwdi part ? ? 28.5 k/kw r th(c-s) contact thermal resistance case to heat sink, ? grease = 1w/m k, d (c-s) = 100 ? m ? 9.0 ? k/kw mechanical characteristics limits symbol item conditions min typ max unit m t m8 : main terminals screw 7.0 ? 22.0 nm m s m6 : mounting screw 3.0 ? 6.0 nm m t mounting torque m4 : auxiliary terminals screw 1.0 ? 3.0 nm m mass ? 0.9 ? kg cti comparative tracking index 600 ? ? ? d a clearance 19.5 ? ? mm d s creepage distance 32.0 ? ? mm l p ce parasitic stray inductance ? 16.5 ? nh r cc?+ee? internal lead resistance t c = 25c ? 0.18 ? m ? r g internal gate resistance t c = 25c ? 2.5 ? ? ? note1. pulse width and repetition rate should be such that junction temperature (t j ) does not exceed t opmax rating. 2. the symbols represent characteristics of the anti-parallel, emitter to collector free-wheel diode (fwd i ). 3. junction temperature (t j ) should not exceed t jmax rating (150c). 4. pulse width and repetition rate should be such as to cause negligible temperature rise. 5. e on(10%) / e off(10%) / e rec(10%) are the integral of 0.1v ce x 0.1i c x dt. 6. definition of all items is according to iec 60747, unless otherwise specified.
< hvigbt modules > CM800HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 4 performance curves output characteristics (typical) 0 400 800 1200 1600 02468 collector - emitter voltage [v] collector current [a] v ge = 10v v ge = 11v v ge = 15v v ge = 13v t j = 25c v ge = 16v collector-emitter saturation voltag e characteristics (typical) 0 400 800 1200 1600 02468 collector-emitter saturation voltage [v] collector current [a] v ge = 15 v t j = 125c t j = 2 5c transfer characteristics (typical) 0 400 800 1200 1600 0 4 8 12 16 gate - emitter voltage [v] collector current [a] t j = 25c v ce = v ge t j = 125c free-wheel diode forward characteristics (typical) 0 400 800 1200 1600 012345 emitter-collector voltage [v] emitter current [a] t j = 25 c t j = 1 25 c
< hvigbt modules > CM800HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 5 performance curves capacitance characteristics (typical) 1 10 100 1000 0.1 1 10 100 collector-emitter voltage [v] capacitance [nf] c ies v ge = 0v, tj = 25c f = 100 khz c oes c res half-bridge switching energy characteristics (typical) 0 2 4 6 8 10 0 400 800 1200 1600 collector current [a] switching energies [j] e rec v cc = 2 800v, v ge = 15v r g(on) = 4.0 ? , r g(off) = 15 ? l s = 150nh, tj = 125c indu ctive lo ad e of f e on gate charge characteristics (typical) -1 5 -1 0 -5 0 5 10 15 20 0246810 gate charge [c] gate-emitter voltage [v] v ce = 2800v, i c = 800a t j = 2 5c half-bridge switching energy characteristics (typical) 0 2 4 6 8 246810 gate resistor [ohm] switching energies [j] e rec v cc = 28 00v, i c = 800a v ge = 15 v, l s = 150 nh tj = 125c, inductive load e on
< hvigbt modules > CM800HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 6 performance curves switching energy characteristics (typical) 0 2 4 6 8 10 15 20 25 30 gate resistor [ohm] switching energies [j] v cc = 2800v, i c = 80 0a v ge = 15v, l s = 1 50nh tj = 125c, ind uctive load e off free-wheel diode reverse recovery characteristics (typical) 0.1 1 10 100 100 1000 10000 emitter current [a] reverse recovery time [s] 10 100 1000 10000 reverse recovery current [a] t rr i rr v cc = 2 800v, v ge = 15v r g(on) = 4.0 ? , l s = 150n h tj = 125c, indu ctive load half-bridge switching time characteristics (typical)half-bridge 0.01 0.1 1 10 100 100 1000 10000 collector current [a] switching times [s] v cc = 28 00v, v ge = 1 5v r g( on) = 4.0 ? , r g(off) = 1 5 ? l s = 150nh, tj = 125c inductive lo ad t r t d(on) t d(off) t f reverse bias safe operating area (rbsoa) 0 500 1000 1500 2000 2500 0 1000 2000 3000 4000 5000 collector-emitter voltage [v] collector current [a] v cc ? 32 00v, v ge = 1 5v tj = 125c, r g(off) = 15 ?
< hvigbt modules > CM800HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 7 performance curves short circuit safe operating area (scsoa) 0 2 4 6 8 10 0 1000 2000 3000 4000 5000 collector-emitter voltage [v] collector current [ka] v cc ? 3200v, v ge = 15 v tj = 125c, r g(on) = 4.0 ? , r g(off) = 15 ? transient thermal impedance characteristics 0 0.2 0.4 0.6 0.8 1 1.2 0.001 0.01 0.1 1 10 time [s] normalized transient thermal impedance rth(j-c)q = 15.0k/kw rth(j-c)d = 28.5k/kw free-wheel diode reverse recovery safe operating area (rrsoa) 0 500 1000 1500 2000 2500 0 1000 2000 3000 4000 5000 emitter-collector voltage [v] reverse recovery current [a] v cc ? 32 00v, di/dt < 4ka/s tj = 125c ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? exp1 rz i t n 1i i )cj(th )t( ? 1234 r i [k/kw] : 0.0096 0.1893 0.4044 0.3967 t i [sec] : 0.0001 0.0058 0.0602 0.3512
< hvigbt modules > CM800HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 8 ? 2012 mitsubishi electric corporation. all rights reserved. keep safety first in your circuit designs! mitsubishi electric corporation puts the maximum effo rt into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (i ii) prevention against any malfunction or mishap. notes regarding these materials ?these materials are intended as a reference to assist our customers in the selection of the mitsubishi semiconductor product best suited to the customer?s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to mitsubishi electric corporation or a third party. ?mitsubishi electric corporation assumes no respons ibility for any damage, or infringement of any third-party?s rights, originating in the use of any pr oduct data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. ?all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the ti me of publication of these materials, and are subject to change by mitsubishi electric corporation without not ice due to product improvements or other reasons. it is therefore recommended that customers contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product dist ributor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. mitsubishi electric corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. please also pay attention to information published by mitsubishi electric corporation by various means, including the mitsubishi semiconductor home page (http://www. mitsubishielectric.com/). ?when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to eval uate all information as a total system before making a final decision on the applicability of the informatio n and products. mitsubishi electric corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. ?mitsubishi electric corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. please contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aer ospace, nuclear, or undersea repeater use. ?the prior written approval of mitsubishi electric corpor ation is necessary to reprin t or reproduce in whole or in part these materials. ?if these products or technologies are subject to the japanese export control restrictions, they must be exported under a license from the japanese government and cannot be imported into a country other t han the approved destination. any diversion or re-export contrary to the export control laws and regulations of japan and/or the country of destination is prohibited. ?please contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product distributor for further details on these materials or the products contained therein.


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